Reducing nitrogen consumption in convection soldering with Rehm Thermal Systems‘ patented mechatronic curtain
Due to the variety of electronic component geometries, the assembly height varies from 5 to 30 mm. These differences lead to the requirement that the throughput height in a convection soldering system be specified at 30 mm upwards and 20 mm downwards. Additionally, due to e-mobility, there is also a need for throughput heights of 50 to 100 mm upwards.… mehr “If the throughput height fits, the nitrogen consumption fits”